? e95444a57-te CXG1012N high-frequency spdt antenna switch ssop-8p-l01 (plastic) absolute maximum ratings (ta=25 ?c) control voltage vctl 6 v operating temperature topr ?5 to +85 ?c storage temperature tstg ?5 to +150 ?c operating condition control voltage 0/3 v description the CXG1012N is an antenna switch mmic. this ic is designed using the sony? gaas j-fet process and operates at a single positive power supply. features single positive power supply operation insertion loss 0.5 db (typ.) at 2.0 ghz medium power switching p1db (typ.) 29 dbm at 2.0 ghz v ctl (h)=3.0v 33 dbm at 2.0 gh z v ctl (h)=4.0 v application antenna switch for digital cordless telephones structure gaas j-fet mmic sony reserves the right to change products and specifications without prior notice. this information does not convey any license by any implication or otherwise under any patents or other right. application circuits shown, if any, are typical examples illustrating the operation of the devices. sony cannot assume responsibility for any problems arising out of the use of these circuits.
? CXG1012N insertion loss isolation insertion loss isolation input vswr output vswr switching time control pin current item symbol condition min. typ. max. unit il1 f=1.0 ghz 0.3 0.6 db iso1 30 35 db il2 f=2.0 ghz 0.5 0.8 db iso2 20 23 db vswrin 1.3 1.5 vswrout 1.3 1.5 tsw 100 ns i ctl 70 150 ? electrical characteristics v ctl (l) =0v, v ctl (h) =3v, pin=21.5dbm (ta=25 ?c) 1 db gain compression point output 1 db gain compression point output p1db (3) v ctl (h) =3 v p1db (4) v ctl (h) =4 v high low port1-port2 on port1-port3 off low high port1-port2 off port1-port3 on vctla vctlb block diagram package outline/pin configuration port1 port2 port3 ctlb port1 gnd ctla gnd gnd port2 port3 1 8 8-pin ssop (plastic) (ta=25 ?c) 26 29 dbm 30 33 dbm v ctl (l) =0v, f =2.0ghz
? CXG1012N recommended circuit example of representative characteristics (ta=25 ?c) 100pf aaaaaaaaaa a aaaaaaaa a a aaaaaaaa a a aaaaaaaa a a aaaaaaaa a aaaaaaaaaa 100pf ctlb port1 ctla port3 port2 100pf 100pf 100pf CXG1012N 1 2 3 4 5 6 7 8 aaaaaaaaaaa a aaaaaaaaa a a aaaaaaaaa a a aaaaaaaaa a a aaaaaaaaa a a aaaaaaaaa a a aaaaaaaaa a aaaaaaaaaaa 0 ? ? ? 0 ?0 ?0 ?0 20 24 28 36 32 40 insertion loss (db) isolation (db) v ctl (h) =3v v ctl (h) =4v v ctl (h) =5v v ctl (h) =3 v v ctl (h) =4v v ctl (h) =5v insertion loss 3 2 1 0 ? ? ? ? ? 0 ?0 ?0 ?0 ?0 ?0 0 frequency (ghz) insertion loss (db) isolation (db) insertion loss, isolation vs. frequency insertion loss isolation insertion loss, isolation vs. input power input power (dbm) isolation
? CXG1012N package outline unit: mm sony code eiaj code jedec code package material lead treatment lead material package weight epoxy resin solder / palladium copper alloy package structure ssop-8p-l01 plating ssop008-p-0044 0.04g 8pin ssop (plastic) 0.24 ?0.07 + 0.08 0.65 * 3.0 0.1 * 4.4 0.1 1.25 ?0.1 + 0.2 0.1 a 6.4 0.2 b 0.24 ?0.07 + 0.08 (0.22) 0.17 ?0.015 + 0.025 (0.15) 0.1 0.05 0.25 0?to 10 0.6 0.15 (0.5) 1 4 5 8 0.13 m detail b a detail note: dimension * ?does not include mold protrusion.
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